Pedro O. Quintero-Aguilo, Ph.D

Pedro O. Quintero-Aguilo, Ph.D

Professor

Office: L-209
pedro.quintero@upr.edu
T: 787-832-4040 x5971
http://www.me.uprm.edu/pquintero

 

Education

  • Ph.D.
 University of Maryland-College Park, Maryland, USA, 2008
  • M.S.
 Universidad de Puerto Rico, Mayaguez, PR, 1998
  • B.S.
 Universidad de Puerto Rico, Mayaguez, PR, 1996

Background

  • 2008-present
 Professor, Department of Mechanical Engineering, University of Puerto Rico at Mayaguez
  • 2005-2008
 Graduate Research Assistant: Department of Mechanical Engineering CALCE Research Center at the University of Maryland-College Park, College Park, MD
  • 2000-2005
 Member of the Technical Staff: Senior Solder Process Specialist, Hewlett-Packard, Aguadilla PR.
  • 2003-2004
 Instructor, Department of General Engineering and Industrial Engineering at the University of Puerto Rico-Mayaguez, Mayaguez, PR
  • 1997-2000
 Manufacturing Engineer, Intel Puerto Rico, Las Piedras, Puerto Rico

 

Academic and Professional Leadership

  • iMAPS member, 2006 until present
  • Member of Colegio de Ingenieros y Agrimensores de Puerto Rico, 17596 PE
  • Reviewer, IEEE Transactions on Components and Packaging Technologies, 2007-
  • Reviewer, Microelectronics Reliability, 2006-
  • Coordinator, Material and Manufacturing Sciences, 2009-

 

 

Conference Publications

  • Quintero, T. Oberc, F.P. McCluskey, “Lead-Free Die Attach Reliability for High Temperature Environments,” Proceedings of iMAPS 40th International Symposium on Microelectronics, San Jose, California, 2007.
  • Quintero, R. Jain, F.P. McCluskey, “Using Prognostics for Extending Maintenance-Free Operation Interval – A case study using Inductive Sensor for Condition Based Maintenance of a Wave Solder Machine,” Proceedings of iMAPS 40th International Symposium on Microelectronics, San Jose, California, 2007.
  • Quintero, B. Geil, F.P. McCluskey, “High Temperature Die Attach by Liquid Phase Sintering,” Proc of HiTEC, Albuquerque, NM, May, 2008.
  • Oberc, P. Quintero, F.P. McCluskey, “Viability of an Alternative High Temperature Surface Mount Component Attach,” Proc of HiTEC, Albuquerque, NM, May, 2008.
  • Quintero, T. Oberc, F.P. McCluskey, “Reliability Assessment of High Temperature Lead-Free Device Attach Technologies,” Proc of ECTC, Orlando, FL, May, 2008.
  • Quintero, R. Valentín, D. Ma, “Decision Matrix as a Valuable Tool for Pb-Free Alloy Selection,” Proceedings of iMAPS 42nd International Symposium on Microelectronics, San Jose, California, 2009
  • Quintero, F.P. McCluskey, B. Koene, “High Temperature Lead-Free Attach Reliability,” ASME Interpack Conf., Vancouver, BC, July 8-12, 2007. IPACK 2007-33457
  • P. Quintero, R. Valentín, P. Cáceres-Valencia, “Combinatorial Studies for the Minimization of Tin Whiskers Growth in Pb-Free Electronics,” ASME Interpack Conf., San Francisco, CA, July 19-23, 2009. IPACK 2009-89029.
  • M. Molina, A. Velasco, W. Otano and P. Quintero, “Pressureless Sintering Progression of a Silver Nanoparticle Attach Material Via Micrographic Analysis,” IMAPS International Conference on High Temperature Electronics (HiTEC 2012), May 8-10, 2012, Albuquerque, New Mexico, USA.
  • R. Rodriguez, D. Ibitayo and P. Quintero, “Microstructural Evolution and Thermal Characterization of a High Temperature Die Attach Lead-Free System,” IMAPS International Conference on High Temperature Electronics (HiTEC 2012), May 8-10, 2012, Albuquerque, New Mexico, USA.
  • L. Renta, P. Quintero, R. Valentin, D. Ma, and A. Hovland, “Study of the thermomechanical inelastic energy response of backward compatible solder joints made with SAC versus re-balled SnPb components,” Proceedings of ASME InterPACK 2011, July 6-8, 2011, Portland, Oregon, USA, InterPACK2011- 52036.
  • R. Rodriguez, D. Ibitayo, and P. Quintero, “High Temperature Die Attach by Low Temperature Solid-Liquid Interdiffusion,” Proceedings of ASME InterPACK 2011, July 6-8, 2011, Portland, Oregon, USA, InterPACK2011-52049.
  • P. Quintero, “Die attach techniques for high temperature/harsh environment packaging: A shifting melting point approach,” Invited speaker at the 2012 Electronic Packaging Symposium, October 9-10, 2012, GE Global Research, Niskayuna, N.Y.
  • P. Quintero, “Physics of Failure, Failure Mechanisms and Damage Analysis,” University of Maryland at College Park as part of Graduate Course ENME 695Invited by Prof. Michael Pecht, Feb. 28, 2011.

 

Major Peer-Reviewed Journal Publications

  • P. Quintero, P. McCluskey, B. Koene, “Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications,” Microelectronics Reliability, Available online 26 September 2013, ISSN 0026-2714, http://dx.doi.org/10.1016/j.microrel.2013.08.002.
  • A. Diaz and P. Quintero, “Tin Nanoparticles Based Solder Paste for Low Temperature Processing,” Journal of Microelectronics and Electronic Packaging, JMEP Issue 4, 2013.
  • R. Rodriguez, D. Ibitayo, and P. Quintero, “Kinetics of Dissolution and Isothermal Solidification for Gold-Enriched Solid–Liquid Interdiffusion (SLID) Bonding,” Journal of Electronic Materials, 2013, DOI: 10.1007/s11664-013-2614-z.
  • Rodriguez, R.I.; Ibitayo, D.; Quintero, P.O., “Thermal Stability Characterization of the Au–Sn Bonding for High-Temperature Applications,” Components, Packaging and Manufacturing Technology, IEEE Transactions on , vol.3, no.4, pp.549,557, April 2013 doi: 10.1109/TCPMT.2013.2243205
  • P. Quintero and F.P. McCluskey, “Temperature cycling reliability of high temperature lead-free die attach technologies,” IEEE Transactions on Device and Materials Reliability, (December 2011), Vol. 11, No. 4, pp. 531-539
  • Quintero and F.P. McCluskey, “Silver-Indium Transient Liquid Phase Sintering for High Temperature Die Attachment,” Journal of Microelectronics and Electronic Packaging, (2009) 6, 1-9.

Awards

  • US patent serial number: US60/891,763; “Ag-In Transient Liquid Phase High Temperature Solder Paste Attach”. Patent filed on January, 2008.
  • Best Professor of Mechanical Engineering voted by students, May 2008
  • UMD Office of Technology Commercialization 2006 Invention of the Year Finalist in Physical Science
  • Best student presenter award given at the CALCE consortium meeting, Fall 2007
  • Best student paper award at the International Conference on High Temperature Electronics (HiTEC 2008).
  • Best poster award at the UMD Mechanical Engineering Research Day (2008) Alfred P. Sloan Scholarship, 2006-2007
  • James Clark Scholarship, 2005-2007
  • Intel Corporation System Manufacturing Divisional Award Winner for work on “Passive Measurement System to avoid Wrong Parts in Electronic Assemblies, Oregon, 1998
Diffusion Soldering and Phase Change Materials for Advanced Packaging of Power Switching Technologies (sponsored by the Army Research Office)

This project seeks to continue the collaboration that has been established between the US Army Research Laboratory and the University of Puerto Rico-Mayaguez for furthering the development, characterization, fabrication, and reliability testing of novel packaging technologies that will advance the DoD quest for wide band-gap power devices. The intellectual merit of the proposed work is related to the fundamental understanding of diffusion soldering that will be gained from the experimental work in collaboration with ARL’s facilities, which in turn, is likely to foster the development of reliable, large area interconnection for SiC microsystems. In the quest for a total packaging solution this project will work towards the incorporation of phase change materials (PCMs) as a thermal management solution.  Modeling and experimental work will be performed as part of the project.

Engineering Analysis, Design, and Prototype Construction of a Semi-Passive Solar Energy Parchment Coffee Dehydration Structure for Applications in Puerto Rico and the Caribbean. (sponsored by the USDA-NRCS)

This work directly addresses the high-energy costs associated with the processing of coffee in Puerto Rico and the Caribbean. This project will aggressively minimize energy consumption using one of the most abundant natural resources: solar energy.  The positive impacts of this effort are far-reaching, including: (1) substantial carbon print reduction, (2) local agricultural economy improvement, (3) coffee industry sustainability, and (4) food security and safety, among others.  The objectives of this project focus specifically on three main areas: (i) Engineering Analysis, (ii) Design and Specifications, (iii) Prototype Construction.